Assignee
KAWANO MASAYA
JP·10 granted patents·50 citations·filing 2005–2012
Top patents by PatentIndex Score
10 records- 0195US8058165B2Semiconductor device and method of manufacturing the sameKAWANO MASAYA·Filed 2010·Granted Nov 15, 2011·17 cites·8 claims
- 0290US8395269B2Method of stacking semiconductor chips including forming an interconnect member and a through electrodeKAWANO MASAYA·Filed 2010·Granted Mar 12, 2013·10 cites·25 claims
- 0381US8830694B2Circuit deviceKAWANO MASAYA·Filed 2011·Granted Sep 9, 2014·4 cites·22 claims
- 0478US8115312B2Semiconductor device having a through electrodeKAWANO MASAYA·Filed 2005·Granted Feb 14, 2012·7 cites·18 claims
- 0575US8085549B2Circuit deviceKAWANO MASAYA·Filed 2009·Granted Dec 27, 2011·4 cites·16 claims
- 0671US8143716B2Semiconductor device with plate-shaped componentKAWANO MASAYA·Filed 2005·Granted Mar 27, 2012·5 cites·22 claims
- 0767US8456019B2Semiconductor deviceKAWANO MASAYA·Filed 2012·Granted Jun 4, 2013·1 cites·16 claims
- 0866US8183685B2Semiconductor deviceKAWANO MASAYA·Filed 2011·Granted May 22, 2012·1 cites·18 claims
- 0963US8436468B2Semiconductor device having a through electrodeKAWANO MASAYA·Filed 2012·Granted May 7, 2013·1 cites·17 claims
- 1053US8310039B2Semiconductor deviceKAWANO MASAYA·Filed 2011·Granted Nov 13, 2012·0 cites·11 claims
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