Assignee
KAWATE KOHICHIRO
JP·1 granted patent·7 pending applications·1 citations·filing 2003–2012
Top patents by PatentIndex Score
8 records- 0155US9230873B2Semiconductor package resin composition and usage method thereofKAWATE KOHICHIRO·Filed 2012·Granted Jan 5, 2016·1 cites·5 claims
- 0248US2010206623A1Nonconductive adhesive composition and film and methods of makingKAWATE KOHICHIRO·Filed 2008·Application pending·0 cites
- 0338US2008283280A1Method for Connecting Printed Circuit BoardsKAWATE KOHICHIRO·Filed 2006·Application pending·0 cites
- 0437US2008156437A1Method for Connecting Flexible Printed Circuit Board to Another Circuit BoardKAWATE KOHICHIRO·Filed 2006·Application pending·0 cites
- 0537US2009127692A1Method of connecting a semiconductor package to a printed wiring boardKAWATE KOHICHIRO·Filed 2005·Application pending·0 cites
- 0636US2009321015A1Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the sameKAWATE KOHICHIRO·Filed 2007·Application pending·0 cites
- 0733US2005224978A1Heat curable adhesive composition, article, semiconductor apparatus and methodKAWATE KOHICHIRO·Filed 2003·Application pending·0 cites
- 0831US2014096622A1Film laminate body for pressure sensitive fingerprint sensorKAWATE KOHICHIRO·Filed 2012·Application pending·0 cites
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