Assignee
KELKAR NIKHIL VISHWANATH
US·2 granted patents·1 pending application·7 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0178US8951847B2Package leadframe for dual side assemblyKELKAR NIKHIL VISHWANATH·Filed 2012·Granted Feb 10, 2015·5 cites·11 claims
- 0262US8558396B2Bond pad configurations for semiconductor diesKELKAR NIKHIL VISHWANATH·Filed 2011·Granted Oct 15, 2013·2 cites·19 claims
- 0337US2012290255A1Clear layer isolationKELKAR NIKHIL VISHWANATH·Filed 2011·Application pending·0 cites
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