Assignee
KIM HEUNG-KYU
KR·3 granted patents·1 citations·filing 2009–2012
Top patents by PatentIndex Score
3 records- 0148US8607448B2Method of manufacturing a printed circuit board having micro strip lineKIM HEUNG-KYU·Filed 2012·Granted Dec 17, 2013·0 cites·3 claims
- 0247US8294529B2Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layerKIM HEUNG-KYU·Filed 2009·Granted Oct 23, 2012·1 cites·7 claims
- 0343US8674781B2Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layerKIM HEUNG-KYU·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
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