Assignee
KIM JINGWAN
KR·3 granted patents·11 citations·filing 2011–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0179US8432028B2Integrated circuit packaging system with package-on-package and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 0264US8310038B2Integrated circuit packaging system with embedded conductive structure and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Nov 13, 2012·2 cites·20 claims
- 0355US8476135B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofKIM JINGWAN·Filed 2011·Granted Jul 2, 2013·1 cites·20 claims
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