Assignee
KIM OH HAN
KR·6 granted patents·32 citations·filing 2008–2013
Top patents by PatentIndex Score
6 records- 0191US8409923B2Integrated circuit packaging system with underfill and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Apr 2, 2013·15 cites·20 claims
- 0279US8604624B2Flip chip interconnection system having solder position control mechanismKIM OH HAN·Filed 2008·Granted Dec 10, 2013·9 cites·5 claims
- 0368US8633586B2Mock bump system for flip chip integrated circuitsKIM OH HAN·Filed 2008·Granted Jan 21, 2014·5 cites·20 claims
- 0461US8513057B2Integrated circuit packaging system with routable underlayer and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Aug 20, 2013·1 cites·20 claims
- 0560US9093415B2Integrated circuit packaging system with heat spreader and method of manufacture thereofKIM OH HAN·Filed 2013·Granted Jul 28, 2015·1 cites·20 claims
- 0659US8859342B2Integrated circuit packaging system with substrate mold gate and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Oct 14, 2014·1 cites·10 claims
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