Assignee
KIM OHHAN
KR·8 granted patents·1 pending application·53 citations·filing 2008–2012
Top patents by PatentIndex Score
9 records- 0191US8273604B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2011·Granted Sep 25, 2012·17 cites·22 claims
- 0290US8519544B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2012·Granted Aug 27, 2013·13 cites·25 claims
- 0383US8786076B2Semiconductor device and method of forming a thermally reinforced semiconductor dieKIM OHHAN·Filed 2011·Granted Jul 22, 2014·7 cites·19 claims
- 0480US8264059B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2011·Granted Sep 11, 2012·4 cites·18 claims
- 0575US9123663B2Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductorKIM OHHAN·Filed 2008·Granted Sep 1, 2015·8 cites·24 claims
- 0672US10163744B2Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structureKIM OHHAN·Filed 2011·Granted Dec 25, 2018·3 cites·14 claims
- 0765US9293349B2Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shieldKIM OHHAN·Filed 2012·Granted Mar 22, 2016·1 cites·25 claims
- 0849US8137995B2Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structuresKIM OHHAN·Filed 2008·Granted Mar 20, 2012·0 cites·21 claims
- 0944US2012153452A1Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect StructuresKIM OHHAN·Filed 2012·Application pending·0 cites
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