Assignee
KIM PYOUNG-WAN
KR·2 granted patents·10 citations·filing 2008–2011
Top patents by PatentIndex Score
2 records- 0180US8093703B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2008·Granted Jan 10, 2012·10 cites·46 claims
- 0247US8846446B2Semiconductor package having buried post in encapsulant and method of manufacturing the sameKIM PYOUNG-WAN·Filed 2011·Granted Sep 30, 2014·0 cites·10 claims
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