Assignee
KIM SEONG CHEOL
KR·10 granted patents·4 pending applications·31 citations·filing 2007–2012
Top patents by PatentIndex Score
14 records- 0188US8478292B2Wireless localization method based on an efficient multilateration algorithm over a wireless sensor network and a recording medium in which a program for the method is recordedKIM SEONG CHEOL·Filed 2011·Granted Jul 2, 2013·16 cites·12 claims
- 0272US8823161B2Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failuresKIM SEONG CHEOL·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 0371US8232642B2Printed circuit boardKIM SEONG CHEOL·Filed 2010·Granted Jul 31, 2012·3 cites·20 claims
- 0467US8803325B2Stacked semiconductor packageKIM SEONG CHEOL·Filed 2012·Granted Aug 12, 2014·2 cites·17 claims
- 0567US8237291B2Stack packageKIM SEONG CHEOL·Filed 2009·Granted Aug 7, 2012·3 cites·20 claims
- 0667US8198719B2Semiconductor chip and semiconductor package including the sameKIM SEONG CHEOL·Filed 2010·Granted Jun 12, 2012·2 cites·18 claims
- 0763US8766457B2Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor packageKIM SEONG CHEOL·Filed 2011·Granted Jul 1, 2014·1 cites·19 claims
- 0859US8399984B2Semiconductor packageKIM SEONG CHEOL·Filed 2009·Granted Mar 19, 2013·1 cites·18 claims
- 0953US2012205802A1Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2012·Application pending·0 cites
- 1052US8183689B2Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2007·Granted May 22, 2012·0 cites·5 claims
- 1152US2009298229A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2009·Application pending·0 cites
- 1249US2008308949A1Flip chip package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2007·Application pending·0 cites
- 1348US9029602B2Anti-microbial and anti-static surface treatment agent with quaternary ammonium salt as active ingredient and method for preventing static electricity in polymer fibers using sameKIM SEONG CHEOL·Filed 2011·Granted May 12, 2015·0 cites·1 claims
- 1439US2012061842A1Stack package and method for manufacturing the sameKIM SEONG CHEOL·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →