Assignee

KIMURA TADAHIRO

JP·1 granted patent·2 citations·filing 2007–2007

Technology mixC09G1 C09K1 H10P1

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0159US8778217B2Polishing slurry for CMP, and polishing methodKIMURA TADAHIRO·Filed 2007·Granted Jul 15, 2014·2 cites·18 claims

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