Assignee
KINSUS INTERCONNECT TECH CORP
TW58 patents
Top patents by PatentIndex Score
US6759318B1Jul 6, 2004
Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process
KINSUS INTERCONNECT TECH CORP32 citations92
US9439290B1Sep 6, 2016
Carrier board structure
KINSUS INTERCONNECT TECH CORP7 citations83
US9831167B1Nov 28, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP7 citations82
US9301405B1Mar 29, 2016
Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole
KINSUS INTERCONNECT TECH CORP10 citations81
US7875809B2Jan 25, 2011
Method of fabricating board having high density core layer and structure thereof
KINSUS INTERCONNECT TECH CORP8 citations81
US9439292B1Sep 6, 2016
Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
KINSUS INTERCONNECT TECH CORP9 citations80
US9198296B1Nov 24, 2015
Double sided board with buried element and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP7 citations78
US7768131B1Aug 3, 2010
Package structure preventing solder overflow on substrate solder pads
KINSUS INTERCONNECT TECH CORP8 citations76
US6969674B2Nov 29, 2005
Structure and method for fine pitch flip chip substrate
KINSUS INTERCONNECT TECH CORP12 citations76
US9847165B2Dec 19, 2017
Winged coil structure and method of manufacturing the same
KINSUS INTERCONNECT TECH CORP2 citations72
US10383265B2Aug 13, 2019
Electromagnetic-interference shielding device
KINSUS INTERCONNECT TECH CORP1 citations71
US9901016B1Feb 20, 2018
Electromagnetic-interference shielding device
KINSUS INTERCONNECT TECH CORP3 citations71
US9406641B2Aug 2, 2016
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP3 citations71
US10170403B2Jan 1, 2019
Ameliorated compound carrier board structure of flip-chip chip-scale package
KINSUS INTERCONNECT TECH CORP2 citations69
US8051558B2Nov 8, 2011
Manufacturing method of the embedded passive device
KINSUS INTERCONNECT TECH CORP5 citations63
US7488675B2Feb 10, 2009
Method for fabricating IC board without ring structure
KINSUS INTERCONNECT TECH CORP2 citations63
US11495390B2Nov 8, 2022
Buildup board structure
KINSUS INTERCONNECT TECH CORP0 citations61
US10440837B2Oct 8, 2019
Manufacturing method of double layer circuit board
KINSUS INTERCONNECT TECH CORP1 citations61
US8377815B2Feb 19, 2013
Manufacturing method of a semiconductor load board
KINSUS INTERCONNECT TECH CORP4 citations60
US7871892B2Jan 18, 2011
Method for fabricating buried capacitor structure
KINSUS INTERCONNECT TECH CORP3 citations60
US7353591B2Apr 8, 2008
Method of manufacturing coreless substrate
KINSUS INTERCONNECT TECH CORP5 citations59
US11044806B2Jun 22, 2021
Method for manufacturing multi-layer circuit board capable of being applied with electrical testing
KINSUS INTERCONNECT TECH CORP0 citations57
US10334719B2Jun 25, 2019
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP1 citations57
US7662662B2Feb 16, 2010
Method for manufacturing carrier substrate
KINSUS INTERCONNECT TECH CORP2 citations55
US7805835B2Oct 5, 2010
Method for selectively processing surface tension of solder mask layer in circuit board
KINSUS INTERCONNECT TECH CORP3 citations54
US7573721B2Aug 11, 2009
Embedded passive device structure and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP1 citations52
US10779418B2Sep 15, 2020
Manufacturing method of double layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10779405B2Sep 15, 2020
Landless multilayer circuit board and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP0 citations51
US10440836B2Oct 8, 2019
Double layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10405423B2Sep 3, 2019
Multi-layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10366822B2Jul 30, 2019
Method of manufacturing winged coil structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10256030B2Apr 9, 2019
Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10256028B2Apr 9, 2019
Buildup board structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10039185B2Jul 31, 2018
Manufacturing method of landless multilayer circuit board
KINSUS INTERCONNECT TECH CORP1 citations51
US9967975B2May 8, 2018
Multi-layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10882296B2Jan 5, 2021
Film-peeling apparatus
KINSUS INTERCONNECT TECH CORP0 citations50
US10104817B1Oct 16, 2018
Electromagnetic-interference shielding device and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP0 citations50
US9754870B2Sep 5, 2017
Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP0 citations50
US9095084B2Jul 28, 2015
Stacked multilayer structure
KINSUS INTERCONNECT TECH CORP0 citations50
US8766102B2Jul 1, 2014
Chip support board structure
KINSUS INTERCONNECT TECH CORP0 citations50
US10548214B2Jan 28, 2020
Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
KINSUS INTERCONNECT TECH CORP0 citations47
US10455694B2Oct 22, 2019
Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing
KINSUS INTERCONNECT TECH CORP0 citations47
US7405146B2Jul 29, 2008
Electroplating method by transmitting electric current from a ball side
KINSUS INTERCONNECT TECH CORP6 citations46
US8547548B1Oct 1, 2013
Final defect inspection system
KINSUS INTERCONNECT TECH CORP1 citations43
US7807034B2Oct 5, 2010
Manufacturing method of non-etched circuit board
KINSUS INTERCONNECT TECH CORP0 citations42
US9370110B2Jun 14, 2016
Method of manufacturing a multilayer substrate structure for fine line
KINSUS INTERCONNECT TECH CORP0 citations41
US10720694B2Jul 21, 2020
Antenna carrier plate structure
KINSUS INTERCONNECT TECH CORP0 citations40
US10371719B2Aug 6, 2019
Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
KINSUS INTERCONNECT TECH CORP0 citations40
US9570227B1Feb 14, 2017
Magnetic excitation coil structure
KINSUS INTERCONNECT TECH CORP0 citations40
US9095085B2Jul 28, 2015
Method of manufacturing a stacked multilayer structure
KINSUS INTERCONNECT TECH CORP0 citations39
Showing the top 50 of 58 patents by PatentIndex Score.