Assignee
KITAE TAKASHI
JP4 patents
Top patents by PatentIndex Score
US8501583B2Aug 6, 2013
Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates
KITAE TAKASHI5 citations72
US8283246B2Oct 9, 2012
Flip chip mounting method and bump forming method
KITAE TAKASHI4 citations61
US9426899B2Aug 23, 2016
Electronic component assembly
KITAE TAKASHI1 citations51
US8709293B2Apr 29, 2014
Flip-chip mounting resin composition and bump forming resin composition
KITAE TAKASHI0 citations40