Assignee
KOHIKI MICHIYA
JP·3 granted patents·3 pending applications·5 citations·filing 2008–2012
Top patents by PatentIndex Score
6 records- 0185US9028972B2Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring boardKOHIKI MICHIYA·Filed 2011·Granted May 12, 2015·4 cites·13 claims
- 0255US8721864B2Process and apparatus for producing a metal covered polyimide compositeKOHIKI MICHIYA·Filed 2012·Granted May 13, 2014·0 cites·9 claims
- 0352US8568899B2Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit boardKOHIKI MICHIYA·Filed 2008·Granted Oct 29, 2013·1 cites·18 claims
- 0444US2013256140A1Electrolytic copper foilKOHIKI MICHIYA·Filed 2011·Application pending·0 cites
- 0543US2014318973A1Electrolytic copper foil and production method of electrolytic copper foilKOHIKI MICHIYA·Filed 2012·Application pending·0 cites
- 0633US2014030591A1Electrolytic copper foil for an anode of a negative electrode collector in a secondary battery and method of producing the sameKOHIKI MICHIYA·Filed 2012·Application pending·0 cites
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