Assignee
KOIKE OSAMU
JP·2 granted patents·9 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0175US9892968B2Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor deviceKOIKE OSAMU·Filed 2009·Granted Feb 13, 2018·4 cites·6 claims
- 0275US8183147B2Method of fabricating a conductive post on an electrodeKOIKE OSAMU·Filed 2011·Granted May 22, 2012·5 cites·10 claims
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