Assignee
KONDO DAIYU
JP·6 granted patents·4 citations·filing 2007–2012
Top patents by PatentIndex Score
6 records- 0178US9085831B2Bundle of long thin carbon structures, manufacturing method therefor, and electronic deviceKONDO DAIYU·Filed 2011·Granted Jul 21, 2015·2 cites·11 claims
- 0266US8932904B2Semiconductor device and method of manufacturing the sameKONDO DAIYU·Filed 2012·Granted Jan 13, 2015·1 cites·1 claims
- 0356US8632885B2Bundle of long thin carbon structures, manufacturing method thereof, and electronic deviceKONDO DAIYU·Filed 2007·Granted Jan 21, 2014·1 cites·20 claims
- 0452US8076260B2Substrate structure and manufacturing method of the sameKONDO DAIYU·Filed 2008·Granted Dec 13, 2011·0 cites·14 claims
- 0548US8258060B2Sheet structure, semiconductor device and method of growing carbon structureKONDO DAIYU·Filed 2010·Granted Sep 4, 2012·0 cites·12 claims
- 0643US9537075B2Graphite structure, electronic component and method of manufacturing electronic componentKONDO DAIYU·Filed 2011·Granted Jan 3, 2017·0 cites·14 claims
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