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KONG BOB
US4 patents
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US8859427B2Oct 14, 2014
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
KONG BOB4 citations72
US8728879B2May 20, 2014
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
KONG BOB2 citations61
US8545998B2Oct 1, 2013
Electroless deposition of platinum on copper
KONG BOB4 citations61
US8143164B2Mar 27, 2012
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
KONG BOB2 citations61