Assignee
KOSAKA TOSHIYUKI
JP·4 granted patents·17 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0179US8563433B2Process to form via hole in semiconductor waferKOSAKA TOSHIYUKI·Filed 2011·Granted Oct 22, 2013·5 cites·15 claims
- 0278US8455951B2Semiconductor deviceKOSAKA TOSHIYUKI·Filed 2010·Granted Jun 4, 2013·6 cites·16 claims
- 0376US8563404B2Process for dividing wafer into individual chips and semiconductor chipsKOSAKA TOSHIYUKI·Filed 2011·Granted Oct 22, 2013·4 cites·9 claims
- 0463US8476166B2Manufacturing method of semiconductor deviceKOSAKA TOSHIYUKI·Filed 2010·Granted Jul 2, 2013·2 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when KOSAKA TOSHIYUKI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →