Assignee
KOSENKO VALENTIN
US4 patents
Top patents by PatentIndex Score
US9018094B2Apr 28, 2015
Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
KOSENKO VALENTIN15 citations82
US8757897B2Jun 24, 2014
Optical interposer
KOSENKO VALENTIN7 citations81
US8431431B2Apr 30, 2013
Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers
KOSENKO VALENTIN4 citations72
US9323010B2Apr 26, 2016
Structures formed using monocrystalline silicon and/or other materials for optical and other applications
KOSENKO VALENTIN3 citations70