Assignee
KUDOSE SATORU
JP·4 granted patents·1 pending application·5 citations·filing 2007–2009
Top patents by PatentIndex Score
5 records- 0162US8129825B2IC chip package employing substrate with a device holeKUDOSE SATORU·Filed 2007·Granted Mar 6, 2012·3 cites·16 claims
- 0256US8193627B2IC chip mounting package provided with IC chip located in device hole formed within a package base memberKUDOSE SATORU·Filed 2007·Granted Jun 5, 2012·2 cites·16 claims
- 0342US8662309B2Method for packing tab tape, and packing structure for tab tapeKUDOSE SATORU·Filed 2009·Granted Mar 4, 2014·0 cites·24 claims
- 0442US8390104B2Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structureKUDOSE SATORU·Filed 2008·Granted Mar 5, 2013·0 cites·9 claims
- 0539US2010252671A1Conductive reelKUDOSE SATORU·Filed 2008·Application pending·0 cites
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