Assignee
KUECHENMEISTER FRANK
DE·1 granted patent·2 pending applications·7 citations·filing 2009–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0178US8580672B2Methods of forming bump structures that include a protection layerKUECHENMEISTER FRANK·Filed 2011·Granted Nov 12, 2013·7 cites·15 claims
- 0242US2010164098A1Semiconductor device including a cost-efficient chip-package connection based on metal pillarsKUECHENMEISTER FRANK·Filed 2009·Application pending·0 cites
- 0335US2012286397A1Die Seal for Integrated Circuit DeviceKUECHENMEISTER FRANK·Filed 2011·Application pending·0 cites
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