Assignee
KUNIMOTO YUJI
JP·6 granted patents·37 citations·filing 2009–2012
Top patents by PatentIndex Score
6 records- 0190US8410614B2Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the sameKUNIMOTO YUJI·Filed 2011·Granted Apr 2, 2013·14 cites·6 claims
- 0282US8907489B2Wiring substrate, method of manufacturing the same, and semiconductor deviceKUNIMOTO YUJI·Filed 2012·Granted Dec 9, 2014·5 cites·3 claims
- 0376US8530753B2Fine wiring package and method of manufacturing the sameKUNIMOTO YUJI·Filed 2009·Granted Sep 10, 2013·8 cites·4 claims
- 0476US8318543B2Method of manufacturing semiconductor deviceKUNIMOTO YUJI·Filed 2009·Granted Nov 27, 2012·5 cites·10 claims
- 0565US8399977B2Resin-sealed package and method of producing the sameKUNIMOTO YUJI·Filed 2009·Granted Mar 19, 2013·3 cites·8 claims
- 0662US8110921B2Semiconductor package and method of manufacturing the sameKUNIMOTO YUJI·Filed 2009·Granted Feb 7, 2012·2 cites·10 claims
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