Assignee
KUO TIN-HAO
TW·3 granted patents·51 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0196US9425136B2Conical-shaped or tier-shaped pillar connectionsKUO TIN-HAO·Filed 2012·Granted Aug 23, 2016·24 cites·17 claims
- 0295US8318596B2Pillar structure having a non-planar surface for semiconductor devicesKUO TIN-HAO·Filed 2010·Granted Nov 27, 2012·24 cites·22 claims
- 0372US9093332B2Elongated bump structure for semiconductor devicesKUO TIN-HAO·Filed 2011·Granted Jul 28, 2015·3 cites·20 claims
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