Assignee
KUO YUNG-HSIN
TW·8 granted patents·37 citations·filing 2009–2012
Top patents by PatentIndex Score
8 records- 0188US9134368B2Contactless wafer probing with improved power supplyKUO YUNG-HSIN·Filed 2012·Granted Sep 15, 2015·15 cites·17 claims
- 0285US8832933B2Method of fabricating a semiconductor test probe headKUO YUNG-HSIN·Filed 2011·Granted Sep 16, 2014·10 cites·19 claims
- 0377US8841931B2Probe card wiring structureKUO YUNG-HSIN·Filed 2011·Granted Sep 23, 2014·4 cites·11 claims
- 0474US8643394B2Non-reflow probe card structureKUO YUNG-HSIN·Filed 2010·Granted Feb 4, 2014·3 cites·22 claims
- 0573US9557370B2Methods of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocationKUO YUNG-HSIN·Filed 2012·Granted Jan 31, 2017·3 cites·20 claims
- 0654US8134380B2Test probe structureKUO YUNG HSIN·Filed 2009·Granted Mar 13, 2012·2 cites·18 claims
- 0748US9261534B2Shield pin arrangementKUO YUNG-HSIN·Filed 2012·Granted Feb 16, 2016·0 cites·20 claims
- 0841US9891273B2Test structures and testing methods for semiconductor devicesKUO YUNG HSIN·Filed 2011·Granted Feb 13, 2018·0 cites·20 claims
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