Assignee

KURAMOTO TAKEO

JP·2 granted patents·13 citations·filing 2004–2010

Technology mixB23K2 H05K2 Y10T2 C22F1 H10P1 H10W1

Top patents by PatentIndex Score

2 records

0186US8701973B2Solder bump formation on a circuit board using a transfer sheetKURAMOTO TAKEO·Filed 2010·Granted Apr 22, 2014·10 cites·5 claims
0247US9821397B2Solder precoating method and workpiece for electronic equipmentKURAMOTO TAKEO·Filed 2004·Granted Nov 21, 2017·3 cites·17 claims

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