Assignee
KURATOMI BUNSHI
JP·3 granted patents·2 pending applications·5 citations·filing 2005–2011
Top patents by PatentIndex Score
5 records- 0164US8119050B2Method of manufacturing a semiconductor deviceKURATOMI BUNSHI·Filed 2005·Granted Feb 21, 2012·4 cites·8 claims
- 0262US8117742B2Fabrication method of semiconductor integrated circuit deviceKURATOMI BUNSHI·Filed 2010·Granted Feb 21, 2012·1 cites·8 claims
- 0340US2009160084A1Manufacturing method of semiconductor deviceKURATOMI BUNSHI·Filed 2006·Application pending·0 cites
- 0440US2008020510A1Fabrication method of semiconductor deviceKURATOMI BUNSHI·Filed 2007·Application pending·0 cites
- 0536US8476113B2Method of manufacturing semiconductor deviceKURATOMI BUNSHI·Filed 2011·Granted Jul 2, 2013·0 cites·16 claims
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