Assignee
KUROSAWA YOSHIAKI
JP·2 granted patents·97 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0195US8196545B2Device and method for manufacturing a semiconductor waferKUROSAWA YOSHIAKI·Filed 2009·Granted Jun 12, 2012·97 cites·12 claims
- 0241US9017145B2Polishing solution distribution apparatus and polishing apparatus having the sameKUROSAWA YOSHIAKI·Filed 2011·Granted Apr 28, 2015·0 cites·18 claims
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