Assignee
KWAN YIU FAI
HK·0 granted patents·3 pending applications·0 citations·filing 2008–2015
Top patents by PatentIndex Score
3 records- 0132US2010155260A1Micro-blasting treatment for lead framesKWAN YIU FAI·Filed 2008·Application pending·0 cites
- 0230US2013098659A1Pre-plated lead frame for copper wire bondingKWAN YIU FAI·Filed 2012·Application pending·0 cites
- 0317US2016204003A1Method of forming asper-silver on a lead frameKWAN YIU FAI·Filed 2015·Application pending·0 cites
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