Assignee
KWON JINSU
US·3 granted patents·66 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0193US8558379B2Flip chip interconnection with double postKWON JINSU·Filed 2008·Granted Oct 15, 2013·54 cites·32 claims
- 0279US8505199B2Method of fabricating an interconnection element having conductive postsKWON JINSU·Filed 2008·Granted Aug 13, 2013·8 cites·26 claims
- 0375US8884448B2Flip chip interconnection with double postKWON JINSU·Filed 2010·Granted Nov 11, 2014·4 cites·16 claims
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