Assignee
KYOCERA AMERICA INC
US·27 granted patents·2 pending applications·561 citations·filing 1989–2016
Top patents by PatentIndex Score
29 records- 0190US6727117B1Semiconductor substrate having copper/diamond composite material and method of making sameKYOCERA AMERICA INC·Filed 2002·Granted Apr 27, 2004·75 cites·19 claims
- 0284US6204448B1High frequency microwave packaging having a dielectric gapKYOCERA AMERICA INC·Filed 1998·Granted Mar 20, 2001·91 cites·10 claims
- 0382US6046707ACeramic multilayer helical antenna for portable radio or microwave communication apparatusKYOCERA AMERICA INC·Filed 1997·Granted Apr 4, 2000·96 cites·20 claims
- 0480US7582964B2Semiconductor package having non-ceramic based window frameKYOCERA AMERICA INC·Filed 2007·Granted Sep 1, 2009·11 cites·3 claims
- 0580US7053729B2Impedence matching along verticle path of microwave vias in multilayer packagesKYOCERA AMERICA INC·Filed 2004·Granted May 30, 2006·16 cites·11 claims
- 0666US6796725B2Opto-electronic package for integrated sealing of optical fibersKYOCERA AMERICA INC·Filed 2001·Granted Sep 28, 2004·13 cites·8 claims
- 0765US7298046B2Semiconductor package having non-ceramic based window frameKYOCERA AMERICA INC·Filed 2003·Granted Nov 20, 2007·14 cites·3 claims
- 0863US6441697B1Ultra-low-loss feedthrough for microwave circuit packageKYOCERA AMERICA INC·Filed 1999·Granted Aug 27, 2002·32 cites·11 claims
- 0962US5314606ALeadless ceramic package with improved solderabiltyKYOCERA AMERICA INC·Filed 1993·Granted May 24, 1994·41 cites·11 claims
- 1060US5258575ACeramic glass integrated circuit package with integral ground and power planesKYOCERA AMERICA INC·Filed 1991·Granted Nov 2, 1993·24 cites·29 claims
- 1158US4992628ACeramic-glass integrated circuit package with ground planeKYOCERA AMERICA INC·Filed 1990·Granted Feb 12, 1991·35 cites·23 claims
- 1255US9331000B2Heat management in electronics packagingKYOCERA AMERICA INC·Filed 2015·Granted May 3, 2016·1 cites·10 claims
- 1354US5231036AMethod of using a contamination shield during the manufacture of EPROM semiconductor package windowsKYOCERA AMERICA INC·Filed 1992·Granted Jul 27, 1993·23 cites·9 claims
- 1452US7808341B2Broadband RF connector interconnect for multilayer electronic packagesKYOCERA AMERICA INC·Filed 2007·Granted Oct 5, 2010·4 cites·10 claims
- 1545US5043004AMethod for making a ceramic lid for hermetic sealing of an EPROM circuitKYOCERA AMERICA INC·Filed 1990·Granted Aug 27, 1991·12 cites·14 claims
- 1638US4931854ALow capacitance integrated circuit packageKYOCERA AMERICA INC·Filed 1989·Granted Jun 5, 1990·14 cites·15 claims
- 1737US5137767APartially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuitKYOCERA AMERICA INC·Filed 1990·Granted Aug 11, 1992·8 cites·10 claims
- 1837US5134246ACeramic-glass integrated circuit package with integral ground and power planesKYOCERA AMERICA INC·Filed 1991·Granted Jul 28, 1992·13 cites·11 claims
- 1937US2016377823A1Optical module and optical module package incorporating a high-thermal-expansion ceramic substrateKYOCERA AMERICA INC·Filed 2016·Application pending·0 cites
- 2036US5095360ACeramic chip-resistant chamfered integrated circuit packageKYOCERA AMERICA INC·Filed 1990·Granted Mar 10, 1992·12 cites·8 claims
- 2136US2006109063A1Matching for ring hybridKYOCERA AMERICA INC·Filed 2004·Application pending·0 cites
- 2235US6703559B2Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthroughKYOCERA AMERICA INC·Filed 2001·Granted Mar 9, 2004·0 cites·8 claims
- 2332US5196919AUse of a contamination shield during the manufacture of semiconductor packagesKYOCERA AMERICA INC·Filed 1990·Granted Mar 23, 1993·6 cites·10 claims
- 2431US6900525B2Semiconductor package having filler metal of gold/silver/copper alloyKYOCERA AMERICA INC·Filed 2003·Granted May 31, 2005·1 cites·6 claims
- 2531US5345038AMulti-layer ceramic packagesKYOCERA AMERICA INC·Filed 1991·Granted Sep 6, 1994·6 cites·9 claims
- 2631US5160747AApparatus for manufacturing ceramic chip-resistant chamfered integrated circuit packageKYOCERA AMERICA INC·Filed 1991·Granted Nov 3, 1992·9 cites·3 claims
- 2726US5482735AMethod for making multi-layer ceramic packagesKYOCERA AMERICA INC·Filed 1994·Granted Jan 9, 1996·3 cites·9 claims
- 2820US10236267B2Methods of forming flip chip systemsKYOCERA AMERICA INC·Filed 2015·Granted Mar 19, 2019·0 cites·18 claims
- 2920US4982494AMethods of making a low capacitance integrated circuit packageKYOCERA AMERICA INC·Filed 1990·Granted Jan 8, 1991·1 cites·17 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →