Assignee
Kyocera slc tech corp
JP·5 granted patents·10 citations·filing 2013–2014
Top patents by PatentIndex Score
5 records- 0177US9426887B2Wiring board and electronic device using the sameKyocera slc tech corp·Filed 2013·Granted Aug 23, 2016·4 cites·8 claims
- 0261US9502340B2Method for manufacturing wiring boardKyocera slc tech corp·Filed 2013·Granted Nov 22, 2016·2 cites·4 claims
- 0355US9565750B2Wiring board for mounting a semiconductor elementKyocera slc tech corp·Filed 2013·Granted Feb 7, 2017·2 cites·14 claims
- 0454US9565760B2Wiring board and method of manufacturing the sameKyocera slc tech corp·Filed 2014·Granted Feb 7, 2017·2 cites·14 claims
- 0531US9655248B2Method of manufacturing a wiring boardKyocera slc tech corp·Filed 2014·Granted May 16, 2017·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →