Assignee
LACAP EFREN M
US·4 granted patents·56 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0196US8106516B1Wafer-level chip scale packageLACAP EFREN M·Filed 2010·Granted Jan 31, 2012·26 cites·38 claims
- 0293US8085553B1Lead assembly for a flip-chip power switchLACAP EFREN M·Filed 2008·Granted Dec 27, 2011·30 cites·52 claims
- 0355US8710664B2Wafer-level chip scale packageLACAP EFREN M·Filed 2012·Granted Apr 29, 2014·0 cites·10 claims
- 0447US8942009B2Lead assembly for a flip-chip power switchLACAP EFREN M·Filed 2011·Granted Jan 27, 2015·0 cites·27 claims
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