Assignee
LACROIX LUKE D
US4 patents
Top patents by PatentIndex Score
US8653662B2Feb 18, 2014
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
LACROIX LUKE D5 citations71
US8759977B2Jun 24, 2014
Elongated via structures
LACROIX LUKE D3 citations60
US8586982B2Nov 19, 2013
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability
LACROIX LUKE D1 citations50
US9057760B2Jun 16, 2015
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
LACROIX LUKE D1 citations48