Assignee

LAI HONG-JEN

TW·0 granted patents·1 pending application·0 citations·filing 2012–2012

Technology mixB23K1 B32B1 H10N1

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1 record

0139US2013152990A1Solid-liquid interdiffusion bonding structure of thermoelectric module and fabricating method thereofLAI HONG-JEN·Filed 2012·Application pending·0 cites

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