Assignee
LAI KUO-CHIH
TW·3 granted patents·2 pending applications·18 citations·filing 2006–2012
Top patents by PatentIndex Score
5 records- 0192US8766319B2Semiconductor device with ultra thin silicide layerLAI KUO-CHIH·Filed 2012·Granted Jul 1, 2014·16 cites·2 claims
- 0270US8541303B2Method for fabricating MOS transistorLAI KUO-CHIH·Filed 2011·Granted Sep 24, 2013·2 cites·6 claims
- 0346US8883650B2Method of removing oxidesLAI KUO-CHIH·Filed 2008·Granted Nov 11, 2014·0 cites·18 claims
- 0441US2007218214A1Method of improving adhesion property of dielectric layer and interconnect processLAI KUO-CHIH·Filed 2006·Application pending·0 cites
- 0535US2008026579A1Copper damascene processLAI KUO-CHIH·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →