Assignee
LAI YI-SHAO
TW·3 granted patents·4 pending applications·10 citations·filing 2005–2011
Top patents by PatentIndex Score
7 records- 0183US8072064B1Semiconductor package and method for making the sameLAI YI-SHAO·Filed 2010·Granted Dec 6, 2011·9 cites·21 claims
- 0252US8253431B2Apparatus and method for testing non-contact pads of a semiconductor device to be testedLAI YI-SHAO·Filed 2010·Granted Aug 28, 2012·1 cites·10 claims
- 0349US2006117865A1Tensile test fixture and tensile test methodLAI YI-SHAO·Filed 2005·Application pending·0 cites
- 0439US8592982B2Semiconductor package having proximity communication signal input terminals and manufacturing methods thereofLAI YI-SHAO·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 0535US2012091575A1Semiconductor Package And Method For Making The SameLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 0635US2011298139A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
- 0735US2011278739A1Semiconductor PackageLAI YI-SHAO·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →