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LAM KEN
US5 patents
Top patents by PatentIndex Score
US8455304B2Jun 4, 2013
Routable array metal integrated circuit package fabricated using partial etching process
LAM KEN4 citations61
US8324023B2Dec 4, 2012
Stacked-die electronics package with planar and three-dimensional inductor elements
LAM KEN2 citations61
US8487424B2Jul 16, 2013
Routable array metal integrated circuit package fabricated using partial etching process
LAM KEN1 citations51
US8237266B2Aug 7, 2012
Component stacking for integrated circuit electronic package
LAM KEN0 citations51
US8174099B2May 8, 2012
Leadless package with internally extended package leads
LAM KEN1 citations51