P

Assignee

LAM RES CORP

US3,256 patents

Top patents by PatentIndex Score

US9996004B2Jun 12, 2018

EUV photopatterning of vapor-deposited metal oxide-containing hardmasks

LAM RES CORP398 citations99
US9997373B2Jun 12, 2018

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP434 citations99
US9997357B2Jun 12, 2018

Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors

LAM RES CORP430 citations99
US9966299B2May 8, 2018

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

LAM RES CORP365 citations99
US9911595B1Mar 6, 2018

Selective growth of silicon nitride

LAM RES CORP388 citations99
US9875891B2Jan 23, 2018

Selective inhibition in atomic layer deposition of silicon-containing films

LAM RES CORP478 citations99
US9865815B2Jan 9, 2018

Bromine containing silicon precursors for encapsulation layers

LAM RES CORP434 citations99
US9852889B1Dec 26, 2017

Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring

LAM RES CORP135 citations99
US9778561B2Oct 3, 2017

Vacuum-integrated hardmask processes and apparatus

LAM RES CORP380 citations99
US9745658B2Aug 29, 2017

Chamber undercoat preparation method for low temperature ALD films

LAM RES CORP375 citations99
US9685320B2Jun 20, 2017

Methods for depositing silicon oxide

LAM RES CORP495 citations99
US9583357B1Feb 28, 2017

Systems and methods for reverse pulsing

LAM RES CORP98 citations99
US9564312B2Feb 7, 2017

Selective inhibition in atomic layer deposition of silicon-containing films

LAM RES CORP415 citations99
US9425078B2Aug 23, 2016

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

LAM RES CORP454 citations99
US9257274B2Feb 9, 2016

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

LAM RES CORP523 citations99
US7858898B2Dec 28, 2010

Bevel etcher with gap control

LAM RES CORP349 citations99
US7651269B2Jan 26, 2010

Temperature probes having a thermally isolated tip

LAM RES CORP498 citations99
US7611640B1Nov 3, 2009

Minimizing arcing in a plasma processing chamber

LAM RES CORP365 citations99
US7274004B2Sep 25, 2007

Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support

LAM RES CORP170 citations99
US7086347B2Aug 8, 2006

Apparatus and methods for minimizing arcing in a plasma processing chamber

LAM RES CORP380 citations99
US7084070B1Aug 1, 2006

Treatment for corrosion in substrate processing

LAM RES CORP247 citations99
US6988327B2Jan 24, 2006

Methods and systems for processing a substrate using a dynamic liquid meniscus

LAM RES CORP164 citations99
US6949204B1Sep 27, 2005

Deformation reduction at the main chamber

LAM RES CORP415 citations99
US6847014B1Jan 25, 2005

Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support

LAM RES CORP704 citations99
US6770166B1Aug 3, 2004

Apparatus and method for radio frequency de-coupling and bias voltage control in a plasma reactor

LAM RES CORP185 citations99
US6527911B1Mar 4, 2003

Configurable plasma volume etch chamber

LAM RES CORP218 citations99
US6483690B1Nov 19, 2002

Ceramic electrostatic chuck assembly and method of making

LAM RES CORP155 citations99
US6432831B2Aug 13, 2002

Gas distribution apparatus for semiconductor processing

LAM RES CORP315 citations99
US6415736B1Jul 9, 2002

Gas distribution apparatus for semiconductor processing

LAM RES CORP365 citations99
US6394026B1May 28, 2002

Low contamination high density plasma etch chambers and methods for making the same

LAM RES CORP107 citations99
US6391787B1May 21, 2002

Stepped upper electrode for plasma processing uniformity

LAM RES CORP153 citations99
US6320320B1Nov 20, 2001

Method and apparatus for producing uniform process rates

LAM RES CORP411 citations99
US6305677B1Oct 23, 2001

Perimeter wafer lifting

LAM RES CORP122 citations99
US6245192B1Jun 12, 2001

Gas distribution apparatus for semiconductor processing

LAM RES CORP407 citations99
US6129808AOct 10, 2000

Low contamination high density plasma etch chambers and methods for making the same

LAM RES CORP215 citations99
US6125025ASep 26, 2000

Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors

LAM RES CORP158 citations99
US5863376AJan 26, 1999

Temperature controlling method and apparatus for a plasma processing chamber

LAM RES CORP281 citations99
US5368710ANov 29, 1994

Method of treating an article with a plasma apparatus in which a uniform electric field is induced by a dielectric window

LAM RES CORP135 citations99
US5356478AOct 18, 1994

Plasma cleaning method for removing residues in a plasma treatment chamber

LAM RES CORP892 citations99
US5226967AJul 13, 1993

Plasma apparatus including dielectric window for inducing a uniform electric field in a plasma chamber

LAM RES CORP427 citations99
US10831096B2Nov 10, 2020

Vacuum-integrated hardmask processes and apparatus

LAM RES CORP34 citations98
US10347547B2Jul 9, 2019

Suppressing interfacial reactions by varying the wafer temperature throughout deposition

LAM RES CORP401 citations98
US10177024B2Jan 8, 2019

High temperature substrate pedestal module and components thereof

LAM RES CORP371 citations98
US10121689B2Nov 6, 2018

Moment cancelling pad raising mechanism in wafer positioning pedestal for semiconductor processing

LAM RES CORP43 citations98
US10115568B2Oct 30, 2018

Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring

LAM RES CORP57 citations98
US10109517B1Oct 23, 2018

Rotational indexer with additional rotational axes

LAM RES CORP58 citations98
US9892917B2Feb 13, 2018

Plasma assisted atomic layer deposition of multi-layer films for patterning applications

LAM RES CORP55 citations98
US9842725B2Dec 12, 2017

Using modeling to determine ion energy associated with a plasma system

LAM RES CORP48 citations98
US9824893B1Nov 21, 2017

Tin oxide thin film spacers in semiconductor device manufacturing

LAM RES CORP442 citations98
US9824884B1Nov 21, 2017

Method for depositing metals free ald silicon nitride films using halide-based precursors

LAM RES CORP348 citations98

Showing the top 50 of 3,256 patents by PatentIndex Score.