Assignee

LAM RES CORPORATON

US·1 granted patent·1 pending application·0 citations·filing 1999–2022

Technology mixB33Y2 H10P2 C22C1 C23C1 H01J1 H01L1

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2 records

0130US2024062997A1Processing parts using solid-state additive manufacturingLAM RES CORPORATON·Filed 2022·Application pending·0 cites
0221US6434775B1Nozzle for rinsing the backside of a semiconductor waferLAM RES CORPORATON·Filed 1999·Granted Aug 20, 2002·0 cites·12 claims

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