P

Assignee

LEARONAL INC

US53 patents

Top patents by PatentIndex Score

US5750018AMay 12, 1998

Cyanide-free monovalent copper electroplating solutions

LEARONAL INC52 citations95
US4871429AOct 3, 1989

Limiting tin sludge formation in tin or tin/lead electroplating solutions

LEARONAL INC75 citations95
US4378270AMar 29, 1983

Method of etching circuit boards and recovering copper from the spent etch solutions

LEARONAL INC51 citations95
US6071398AJun 6, 2000

Programmed pulse electroplating process

LEARONAL INC78 citations94
US5174887ADec 29, 1992

High speed electroplating of tinplate

LEARONAL INC56 citations94
US5302278AApr 12, 1994

Cyanide-free plating solutions for monovalent metals

LEARONAL INC43 citations93
US5256275AOct 26, 1993

Electroplated gold-copper-silver alloys

LEARONAL INC35 citations92
US5085744AFeb 4, 1992

Electroplated gold-copper-zinc alloys

LEARONAL INC23 citations92
US4717460AJan 5, 1988

Tin lead electroplating solutions

LEARONAL INC28 citations92
US4701244AOct 20, 1987

Bath and process for electroplating tin, lead and tin/alloys

LEARONAL INC31 citations92
US4681670AJul 21, 1987

Bath and process for plating tin-lead alloys

LEARONAL INC33 citations92
US4640746AFeb 3, 1987

Bath and process for plating tin/lead alloys on composite substrates

LEARONAL INC28 citations92
US4628165ADec 9, 1986

Electrical contacts and methods of making contacts by electrodeposition

LEARONAL INC48 citations92
US4617097AOct 14, 1986

Process and electrolyte for electroplating tin, lead or tin-lead alloys

LEARONAL INC32 citations92
US4565610AJan 21, 1986

Bath and process for plating lead and lead/tin alloys

LEARONAL INC42 citations91
US4565609AJan 21, 1986

Bath and process for plating tin, lead and tin-lead alloys

LEARONAL INC43 citations91
US5312539AMay 17, 1994

Electrolytic tin plating method

LEARONAL INC47 citations89
US4847114AJul 11, 1989

Preparation of printed circuit boards by selective metallization

LEARONAL INC26 citations89
US4520046AMay 28, 1985

Metal plating on plastics

LEARONAL INC30 citations89
US4591415AMay 27, 1986

Plating baths and methods for electro-deposition of gold or gold alloys

LEARONAL INC38 citations87
US6210556B1Apr 3, 2001

Electrolyte and tin-silver electroplating process

LEARONAL INC32 citations86
US5378347AJan 3, 1995

Reducing tin sludge in acid tin plating

LEARONAL INC27 citations86
US5492615AFeb 20, 1996

Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating baths

LEARONAL INC23 citations85
US5106473AApr 21, 1992

Process for metallizing a through-hole board

LEARONAL INC22 citations83
US4904354AFeb 27, 1990

Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof

LEARONAL INC29 citations83
US5066367ANov 19, 1991

Limiting tin sludge formation in tin or tin/lead electroplating solutions

LEARONAL INC19 citations81
US4762560AAug 9, 1988

Copper colloid and method of activating insulating surfaces for subsequent electroplating

LEARONAL INC18 citations81
US4599149AJul 8, 1986

Process for electroplating tin, lead and tin-lead alloys and baths therefor

LEARONAL INC23 citations80
US4994155AFeb 19, 1991

High speed tin, lead or tin/lead alloy electroplating

LEARONAL INC21 citations78
US4880507ANov 14, 1989

Tin, lead or tin/lead alloy electrolytes for high speed electroplating

LEARONAL INC19 citations78
US4233344ANov 11, 1980

Method of improving the adhesion of electroless metal deposits employing colloidal copper activator

LEARONAL INC20 citations78
US4490220ADec 25, 1984

Electrolytic copper plating solutions

LEARONAL INC23 citations75
US4478692AOct 23, 1984

Electrodeposition of palladium-silver alloys

LEARONAL INC13 citations74
US4465563AAug 14, 1984

Electrodeposition of palladium-silver alloys

LEARONAL INC12 citations74
US5094726AMar 10, 1992

Limiting tin sludge formation in tin or tin-lead electroplating solutions

LEARONAL INC14 citations73
US4877450AOct 31, 1989

Formaldehyde-free electroless copper plating solutions

LEARONAL INC17 citations73
US4681630AJul 21, 1987

Method of making copper colloid for activating insulating surfaces

LEARONAL INC9 citations73
US4622110ANov 11, 1986

Palladium plating

LEARONAL INC6 citations73
US4545868AOct 8, 1985

Palladium plating

LEARONAL INC10 citations73
US4399006AAug 16, 1983

Silver plating

LEARONAL INC11 citations72
US4247372AJan 27, 1981

Silver plating

LEARONAL INC9 citations72
USRE35513EMay 20, 1997

Cyanide-free plating solutions for monovalent metals

LEARONAL INC12 citations71
US4759952AJul 26, 1988

Process for printed circuit board manufacture

LEARONAL INC14 citations70
US4582729AApr 15, 1986

Process for electro-magnetic interference shielding

LEARONAL INC15 citations70
US4556587ADec 3, 1985

Process for electro-magnetic interference shielding

LEARONAL INC7 citations70
US5522972AJun 4, 1996

Nickel hypophosphite manufacture

LEARONAL INC9 citations69
US5427677AJun 27, 1995

Flux for reflowing tinplate

LEARONAL INC11 citations69
US4919720AApr 24, 1990

Electroless gold plating solutions

LEARONAL INC11 citations66
US5578182ANov 26, 1996

Electrolytic production of hypophosphorous acid

LEARONAL INC4 citations63
US4741818AMay 3, 1988

Alkaline baths and methods for electrodeposition of palladium and palladium alloys

LEARONAL INC4 citations63

Showing the top 50 of 53 patents by PatentIndex Score.