Assignee
LEE BO-I
TW·4 granted patents·38 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0194US8803332B2Delamination resistance of stacked dies in die sawLEE BO-I·Filed 2010·Granted Aug 12, 2014·29 cites·20 claims
- 0279US8242611B2Bonding metallurgy for three-dimensional interconnectLEE BO-I·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 0375US10857649B2Method and apparatus for performing a polishing process in semiconductor fabricationLEE BO I·Filed 2011·Granted Dec 8, 2020·4 cites·18 claims
- 0450US9242342B2Manufacture and method of making the sameLEE BO-I·Filed 2012·Granted Jan 26, 2016·0 cites·20 claims
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