Assignee
LEE CHANG-HSIAO
TW·4 granted patents·1 pending application·2 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0163US8735295B2Method of manufacturing dual damascene structureLEE CHANG-HSIAO·Filed 2012·Granted May 27, 2014·2 cites·18 claims
- 0247US8277674B2Method of removing post-etch residuesLEE CHANG-HSIAO·Filed 2009·Granted Oct 2, 2012·0 cites·11 claims
- 0346US8137472B2Semiconductor processLEE CHANG-HSIAO·Filed 2011·Granted Mar 20, 2012·0 cites·15 claims
- 0435US8592304B2Method for filling metalLEE CHANG-HSIAO·Filed 2010·Granted Nov 26, 2013·0 cites·15 claims
- 0533US2012156885A1Method and system for processing semiconductor waferLEE CHANG-HSIAO·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →