Assignee

LEE CHENG-CHIH

0 granted patents·1 pending application·0 citations·filing 2008–2008

Technology mixF28D1 F28F1 H10W1

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1 record

0141US2009194252A1Heat dissipation module and supporting element thereofLEE CHENG-CHIH·Filed 2008·Application pending·0 cites

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