Assignee
LEE CHIA-EN
TW·9 granted patents·1 pending application·30 citations·filing 2009–2012
Top patents by PatentIndex Score
10 records- 0176US8278681B2Light-emitting diode package and wafer-level packaging process of light-emitting diodeLEE CHIA-EN·Filed 2009·Granted Oct 2, 2012·7 cites·8 claims
- 0275US8070320B2Laser illumination device with adjustable light outputLEE CHIA-EN·Filed 2009·Granted Dec 6, 2011·4 cites·20 claims
- 0353US2012193663A1Light emitting diode and fabrication method thereofLEE CHIA-EN·Filed 2011·Application pending·0 cites
- 0451USD668234SLED chipLEE CHIA-EN·Filed 2011·Granted Oct 2, 2012·8 cites·1 claims
- 0546US8445327B2Light-emitting diode package and wafer-level packaging process of light-emitting diodeLEE CHIA-EN·Filed 2012·Granted May 21, 2013·0 cites·14 claims
- 0646US8415683B2Light emitting diode chipLEE CHIA-EN·Filed 2009·Granted Apr 9, 2013·0 cites·24 claims
- 0743US8225670B2Device and method of testing a vibrating deviceLEE CHIA-EN·Filed 2009·Granted Jul 24, 2012·0 cites·10 claims
- 0840USD669869SLED chipLEE CHIA-EN·Filed 2011·Granted Oct 30, 2012·4 cites·1 claims
- 0939USD680976SLED chipLEE CHIA-EN·Filed 2011·Granted Apr 30, 2013·4 cites·1 claims
- 1036USD680975SLED chipLEE CHIA-EN·Filed 2011·Granted Apr 30, 2013·3 cites·1 claims
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