Assignee
LEE CHIEN-CHEN
TW·1 granted patent·1 pending application·2 citations·filing 2004–2012
Top patents by PatentIndex Score
2 records- 0151US9230896B2Semiconductor device and method of reflow soldering for conductive column structure in flip chip packageLEE CHIEN CHEN·Filed 2012·Granted Jan 5, 2016·2 cites·13 claims
- 0231US2006006504A1Multilayer leadframe module with embedded passive component and method of fabricating the sameLEE CHIEN-CHEN·Filed 2004·Application pending·0 cites
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