Assignee
LEE CHUN
US4 patents
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US8169351B2May 1, 2012
Feedback circuits with DC offset cancellation
LEE CHUN7 citations80
US8546504B2Oct 1, 2013
Extrusion processes using high melt strength polypropylene
LEE CHUN2 citations59
US8575252B2Nov 5, 2013
Controlled rheology formulations containing high melt strength polypropylene for extrusion coating
LEE CHUN0 citations48
US8389632B2Mar 5, 2013
Co-continuous heterophase polymer compositions containing high melt strength polypropylene for extrusion coating
LEE CHUN1 citations48