Assignee
LEE HO-JIN
KR17 patents
Top patents by PatentIndex Score
US8592991B2Nov 26, 2013
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
LEE HO-JIN31 citations92
US8592988B2Nov 26, 2013
Semiconductor device
LEE HO-JIN19 citations91
US9859191B2Jan 2, 2018
Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
LEE HO-JIN12 citations84
US8952543B2Feb 10, 2015
Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices
LEE HO-JIN15 citations84
US8335255B2Dec 18, 2012
Motion estimation method, medium, and system with fast motion estimation
LEE HO-JIN13 citations84
US9171753B2Oct 27, 2015
Semiconductor devices having conductive via structures and methods for fabricating the same
LEE HO-JIN7 citations83
US8637989B2Jan 28, 2014
Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
LEE HO-JIN9 citations83
US8492902B2Jul 23, 2013
Multi-layer TSV insulation and methods of fabricating the same
LEE HO-JIN8 citations83
US8415804B2Apr 9, 2013
Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
LEE HO-JIN7 citations83
US9852965B2Dec 26, 2017
Semiconductor devices with through electrodes and methods of fabricating the same
LEE HO-JIN6 citations73
US9153489B2Oct 6, 2015
Microelectronic devices having conductive through via electrodes insulated by gap regions
LEE HO-JIN5 citations72
US8433293B2Apr 30, 2013
Apparatus and method for providing contents push service, and mobile terminal and operation method thereof
LEE HO-JIN4 citations63
US9219035B2Dec 22, 2015
Integrated circuit chips having vertically extended through-substrate vias therein
LEE HO-JIN1 citations62
US8629059B2Jan 14, 2014
Methods of forming integrated circuit chips having vertically extended through-substrate vias therein
LEE HO-JIN3 citations62
US8564139B2Oct 22, 2013
Semiconductor devices including protected barrier layers
LEE HO-JIN4 citations62
US9025089B2May 5, 2015
Touch panel device
LEE HO-JIN1 citations52
US8217768B2Jul 10, 2012
Video reproduction apparatus and method for providing haptic effects
LEE HO-JIN0 citations52