Assignee
LEE HONG-JI
TW·3 granted patents·2 citations·filing 2008–2009
Top patents by PatentIndex Score
3 records- 0165US8304175B2Patterning methodLEE HONG-JI·Filed 2009·Granted Nov 6, 2012·2 cites·18 claims
- 0244US8697340B2Semiconductor structure and method of fabricating the sameLEE HONG-JI·Filed 2008·Granted Apr 15, 2014·0 cites·18 claims
- 0342US8445346B2Method of reducing wordline shortingLEE HONG-JI·Filed 2009·Granted May 21, 2013·0 cites·21 claims
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