Assignee
LEE HYUNGMIN
KR·1 granted patent·1 pending application·7 citations·filing 2011–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0178US8710668B2Integrated circuit packaging system with laser hole and method of manufacture thereofLEE HYUNGMIN·Filed 2011·Granted Apr 29, 2014·7 cites·18 claims
- 0233US2012326324A1Integrated circuit packaging system with package stacking and method of manufacture thereofLEE HYUNGMIN·Filed 2011·Application pending·0 cites
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