Assignee
LEE JAEHYUN
KR·5 granted patents·22 citations·filing 2011–2012
Top patents by PatentIndex Score
5 records- 0184US8952529B2Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voidsLEE JAEHYUN·Filed 2011·Granted Feb 10, 2015·9 cites·37 claims
- 0284US8642384B2Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliabilityLEE JAEHYUN·Filed 2012·Granted Feb 4, 2014·6 cites·25 claims
- 0371US9054100B2Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrateLEE JAEHYUN·Filed 2011·Granted Jun 9, 2015·3 cites·25 claims
- 0464US9230933B2Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structureLEE JAEHYUN·Filed 2011·Granted Jan 5, 2016·2 cites·15 claims
- 0564US8524538B2Integrated circuit packaging system with film assistance mold and method of manufacture thereofLEE JAEHYUN·Filed 2011·Granted Sep 3, 2013·2 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →