Assignee
LEE JIN HUI
KR·2 granted patents·1 pending application·9 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0179US8884445B2Semiconductor chip and stacked semiconductor package having the sameLEE JIN HUI·Filed 2012·Granted Nov 11, 2014·8 cites·12 claims
- 0255US8581385B2Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the sameLEE JIN HUI·Filed 2010·Granted Nov 12, 2013·1 cites·20 claims
- 0334US2011304027A1Semiconductor chip with through electrodes and method for manufacturing the sameLEE JIN HUI·Filed 2011·Application pending·0 cites
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